One of the challenges faced by liquid cooling solution providers is demonstrating the technology’s capacity to facilitate chip-level cooling
up to and beyond 1000W. The dense IT equipment needed to support AI – predominantly CPUs and GPUs – will require this type of cooling capability within the next three years. There has been a perception in the industry that single-phase liquid cooling is limited to approximately 400W. However, there are ongoing efforts to actively demonstrate how single-phase liquid cooling can achieve 1000W cooling.

Iceotope’s enclosed chassis Precision Liquid Cooling solution has achieved this industry milestone with our patented KUL SINK designs. This paper will share the results from a series of tests recently conducted to demonstrate the thermal performance of Precision Liquid Cooling.

 

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